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FEO MAGAZINE - November 2008
Issue 5 Available Now!
HAPPY BIRTHDAY FEO!!!
Welcome to the first anniversary edition of FEO, our special ISMI Manufacturing Effectiveness edition. The vast majority of the editorial in this issue is based on the cream of the presentations from the recently held ISMI Manufacturing Effectiveness Conference held in Austin in late October. As part of our partnership with ISMI, we’re happy to present articles based on the best presentations written for us by the original presenters for you, our readers, who perhaps couldn’t make it to the event itself.
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In this issue:
Business Infrastructure
 FEO5: Business Infrastructure
We have collectively become experts in Lean Manufacturing, Six Sigma, theory of constraints, self-directed work teams, total productive maintenance, and will become experts on whatever “world-class” technique comes along next. We might even buy the book.
FEO5: Business Infrastructure
The current economic downturn magnifies an old problem – that manufacturing jobs are at the lowest level since 1950, and this does not include the current factory shutdowns.
The Yo-Yo Effect
An examination of why new “final solutions” don’t seem to help factories run more efficiently and why managers seem to make the same mistakes, as well as what might be done to achieve significant, sustainable improvement both in factory performance and management decision making.
Asset Utilization
FEO5: Asset Utilization
In this industry, where tough times come and go with the same frequency as the changing of seasons, the one thing that survival depends on is planning.
Spansion Submicron Development Center 200 mm to 300 mm Conversion Feasibility Study Summary
A high-level summary of a provider of Flash memory solutions’ pre-conversion feasibility studies.
Automation Capabilities Management (ACM): Past, Present and Future
An overview of past and present successes of automation capabilities management that also describes new challenges and opportunities ahead.
Fab Productivity
FEO5 : Fab Productivity
Despite our best engineering efforts to keep everything the same, the world has a different idea.
FEO5: Fab Productivity
Now more than ever, focusing on improving productivity and driving down cost should be high on the manufacturing manager’s list of focus areas.
DoE Method for Stress Optimization of PECVD Dielectric Thin Films Used in Microelectronics: Part I
Part 1 of a 2-part work dealing with definition and application of DoE for PECVD thin dielectric films in order to optimize the intrinsic stress. This part focuses on the final interconnection level.
Advances in Wafer Reclaim Technology
A demonstration of how a specific test wafer reclaim process can reclaim test wafers yielding high substrate quality and low silicon loss, allowing for significantly more reclaim cycles than typical reclaim methods, which results in significant cost savings.
Quality Control
FEO5: Quality Control
Yield improvement in the semiconductor industry is a never-ending quest. It is like climbing a mountain (with occasional falls and drops that people in the industry euphemistically call “excursions”) to reach the top, only to face the reality that there is yet another peak to scale for the next technology node.
Fast Learning Cycle (FLC) Methodology for Yield Improvement
A paper that outlines a comprehensive framework – fast learning cycle – that allows for yield improvement in a complex manufacturing environment.
Litho Track-Induced Charging: Effects, Detection, Reduction & Prevention
A look at why lowering the charging from the track by reducing rinse time or rinse spin speed can help alleviate early breakdown of high voltage gate oxide capacitors.
Supply Chain Management
FEO5: Supply Chain Management
Adopting any new standard will depend on the perceived amount of utility that one will receive; bottom line, if one has to adopt the standard to create or maintain revenue, then the standard will be adopted. The pursuant amount of information given, however, may just fulfill the minimum requirement.
Managing Materials Information in the Supply Chain
How developing robust data exchange standards can specifically address the complexity of material information managing.
Environmental Health & Safety
FEO5: Environmental Health & Safety
What more powerful motivation do we need?
FEO5: Environmental Health & Safety
With increasing energy costs and increased awareness of the impact of carbon emissions, we have an opportunity to continue expanding innovation throughout the semiconductor manufacturing life cycle.
Supply Chain Carbon Management: A Proposed Approach for Tangible Results
A proposed approach for managing supply chain GHG being implemented by a coalition of electronics companies called the Electronics Industry Citizenship Coalition. It is a preliminary step toward achieving tangible results while life cycle assessments evolve to provide accurate quantification of full-product direct and indirect impacts.
How to Deliver the Goods While Using Fewer Resources, or ‘Less Is More Than Moore’
One way to prioritize and quantify where to improve your ability to measure and thus manage your usage of resources, as a prerequisite to more tightly manage your operation’s profit and quality capabilities.
Third-Party Considerations
FEO5: Third-Party Considerations
Silicon Valley is in the center of the semiconductor subduction zone.
With regular frequency, semiconductor device makers and suppliers to our industry are sliding underneath each other and moving down into the mantle to be churned, some to be burned up and some to reemerge as new companies as if through the volcanic process.
SEMI Acquires SEC/N
Why buying, selling, refurbishing and servicing of secondhand equipment can be considered a legitimate, important and integral part of the semiconductor industry.
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